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论文题目:
Microstructural evolution during thermal shock process and the residual strength of Si3N4 ceramics
作者:
Yang, Xiao; Liu, Xuejian; Zhang, Hui; Huang, Zhengren
刊物名称:
INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY
发表年度:
2022
卷:
19
期:
6
页码:
3410-3419
